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VERSION:2.0
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BEGIN:VEVENT
UID:20936698-dfad-483f-bd4a-c7481345c4ee@nexttoyou
DTSTAMP:20261105T155735Z
DTSTART:20261106T020000Z
DTEND:20261106T033000Z
SUMMARY:Signal Integrity Challenges in Modern AI Computers: Package and PC
 B Materials
LOCATION:Engineering Center ECCR 200\, 1111 Engineering Drive\, Boulder\, 
 CO 80309
DESCRIPTION:Darren Hitchcock\, senior business development manager\, Panas
 onic will cover how how package and PCB material choices affect signal in
 tegrity\, manufacturability\, and performance in high-speed systems.\n\nT
 his presentation is in association with CU Boulder’s High Speed Digital E
 ngineering (HSD) Program. We aim to connecting students\, researchers\, a
 nd industry professionals through technical talks on signal integrity\, p
 ackaging\, PCB design\, interconnects\, power integrity\, and modern high
 -performance computing.\n\nhttp://next-to-u.app/events/20936698-dfad-483f
 -bd4a-c7481345c4ee
URL:http://next-to-u.app/events/20936698-dfad-483f-bd4a-c7481345c4ee
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