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VERSION:2.0
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BEGIN:VEVENT
UID:2fca1fd0-4010-40af-8adb-ed3a7f47a810@nexttoyou
DTSTAMP:20261106T171750Z
DTSTART:20261120T003000Z
DTEND:20261120T015000Z
SUMMARY:Data Center Expansion: Challenges and Solutions for Thermal Manage
 ment and Materials Access
LOCATION:Bishop Auditorium\, 518 Memorial Way\, Stanford\, CA 94305
DESCRIPTION:As data center expansion accelerates worldwide\, growing deman
 d for computing infrastructure is creating new challenges for thermal man
 agement and critical materials. Himanshu Pokharna\, CEO of Deep Materials
 \, will share his perspectives on these challenges\, drawing on the work 
 of Deep Materials and Inficold to explore emerging solutions and the broa
 der international implications of this growing demand.\n\nDeep Materials 
 is a technology company that specializes in thermal management solutions 
 and high-performance thermal interface materials (TIMs) for modern electr
 onics\, AI infrastructure\, and enterprise data centers.\n\nDr. Richard D
 asher\, Director of the US-ATMC\, will moderate the session.\n\nAbout our
  speaker:\n\nHimanshu Pokharna is the Chief Executive Officer at Deep Mat
 erials\, bringing extensive experience in thermal management solutions an
 d technology innovation.\n\nAs the Founder & Director of Inficold\, Himan
 shu has demonstrated entrepreneurial leadership in developing refrigerati
 on and cold chain solutions\, integrating solar energy for efficient cool
 ing across various applications. Their background reflects a strong focus
  on technology innovation and business development.\n\nPrior to Deep Mate
 rials and Inficold\, Himanshu held key leadership positions in technology
 -driven companies. As Chief Technology Officer at Ventiva\, they provided
  product direction and built thermal\, fluid\, and acoustic capabilities.
  Their tenure at Sheetak as Board Member\, Vice President of Business Dev
 elopme\n\nhttp://next-to-u.app/events/2fca1fd0-4010-40af-8adb-ed3a7f47a81
 0
URL:http://next-to-u.app/events/2fca1fd0-4010-40af-8adb-ed3a7f47a810
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