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Signal Integrity Challenges in Modern AI Computers: Package and PCB Materials · NextToU

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Signal Integrity Challenges in Modern AI Computers: Package and PCB Materials

Name: Signal Integrity Challenges in Modern AI Computers: Package and PCB Materials
Start: 2026-11-06T02:00:00+00:00
End: 2026-11-06T03:30:00+00:00
Location: Engineering Center ECCR 200

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When: Thursday, November 5, 20267:00 PM – 8:30 PM MSTAdd to calendar Google Calendar
Where: Engineering Center ECCR 2001111 Engineering Drive, Boulder, CO 80309Open in Maps

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EngineeringComputer Science & Tech

About

Darren Hitchcock, senior business development manager, Panasonic will cover how how package and PCB material choices affect signal integrity, manufacturability, and performance in high-speed systems.

This presentation is in association with CU Boulder’s High Speed Digital Engineering (HSD) Program. We aim to connecting students, researchers, and industry professionals through technical talks on signal integrity, packaging, PCB design, interconnects, power integrity, and modern high-performance computing.

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This event is organized by its host, not by NextToU. Details come from a public CU Boulder event listing and may change — check the original event for the latest information.